Issued Patents All Time
Showing 1–25 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255123 | Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems | Onnik Yaglioglu, Richard T. Chen, Will J. Tan, Jia Li, Uri Frodis +1 more | 2025-03-18 |
| 12196781 | Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes | Arun S. Veeramani, Ming Ting Wu | 2025-01-14 |
| 12196782 | Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes | Arun S. Veeramani, Ming Ting Wu | 2025-01-14 |
| 12066462 | Probes with planar unbiased spring elements for electronic component contact and methods for making such probes | Arun S. Veeramani | 2024-08-20 |
| 11999016 | Methods of forming parts using laser machining | Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard +3 more | 2024-06-04 |
| 11867721 | Probes with multiple springs, methods for making, and methods for using | Ming Ting Wu, Garret R. Smalley | 2024-01-09 |
| 11828775 | Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships | Michael S. Lockard, Uri Frodis | 2023-11-28 |
| 11821918 | Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions | Michael S. Lockard, Stefano Felici, Uri Frodis | 2023-11-21 |
| 11630127 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen +2 more | 2023-04-18 |
| 11145947 | Miniature RF and microwave components and methods for fabricating such components | Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard +1 more | 2021-10-12 |
| 10788512 | Cantilever microprobes for contacting electronic components | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2020-09-29 |
| 10676836 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang +2 more | 2020-06-09 |
| 10641792 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen +2 more | 2020-05-05 |
| 10416192 | Cantilever microprobes for contacting electronic components | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2019-09-17 |
| 10215775 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen +2 more | 2019-02-26 |
| 9919472 | Stacking and bonding methods for forming multi-layer, three-dimensional, millimeter scale and microscale structures | Adam L. Cohen, Michael S. Lockard, Rulon J. Larsen, III, Uri Frodis, Kieun Kim | 2018-03-20 |
| 9878401 | Methods of forming parts using laser machining | Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard +3 more | 2018-01-30 |
| 9671429 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen +2 more | 2017-06-06 |
| 9620834 | Method for fabricating miniature structures or devices such as RF and microwave components | Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard +1 more | 2017-04-11 |
| 9614266 | Miniature RF and microwave components and methods for fabricating such components | Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard +1 more | 2017-04-04 |
| 9597834 | Electrochemical fabrication method including elastic joining of structures | Adam L. Cohen, Vacit Arat, Michael S. Lockard | 2017-03-21 |
| 9546431 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang +2 more | 2017-01-17 |
| 9540233 | Methods of forming three-dimensional structures having reduced stress and/or curvature | Ananda H. Kumar, Jorge Sotelo Albarran, Adam L. Cohen, Kieun Kim, Michael S. Lockard +1 more | 2017-01-10 |
| 9533376 | Methods of forming parts using laser machining | Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard +3 more | 2017-01-03 |
| 9512532 | Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids | — | 2016-12-06 |