Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10676836 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Kieun Kim, Gang Zhang, Uri Frodis +2 more | 2020-06-09 |
| 9546431 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Kieun Kim, Gang Zhang, Uri Frodis +2 more | 2017-01-17 |
| 7524427 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Kieun Kim, Gang Zhang, Uri Frodis +2 more | 2009-04-28 |
| 7517462 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Kieun Kim, Gang Zhang, Uri Frodis +2 more | 2009-04-14 |
| 7488686 | Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures | Adam L. Cohen, Dennis R. Smalley, Michael S. Lockard | 2009-02-10 |
| 7288178 | Methods of and apparatus for making high aspect ratio microelectromechanical structures | Adam L. Cohen, Gang Zhang, Michael S. Lockard, Dennis R. Smalley | 2007-10-30 |
| 7172684 | Methods of and apparatus for making high aspect ratio microelectromechanical structures | Adam L. Cohen, Gang Zhang | 2007-02-06 |
| 7109118 | Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures | Adam L. Cohen, Dennis R. Smalley, Michael S. Lockard | 2006-09-19 |