Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11630127 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar +2 more | 2023-04-18 |
| 11211228 | Neutral radical etching of dielectric sacrificial material from reentrant multi-layer metal structures | Adam L. Cohen | 2021-12-28 |
| 10641792 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar +2 more | 2020-05-05 |
| 10297421 | Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures | Adam L. Cohen | 2019-05-21 |
| 10215775 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar +2 more | 2019-02-26 |
| 9919472 | Stacking and bonding methods for forming multi-layer, three-dimensional, millimeter scale and microscale structures | Adam L. Cohen, Michael S. Lockard, Uri Frodis, Kieun Kim, Dennis R. Smalley | 2018-03-20 |
| 9671429 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar +2 more | 2017-06-06 |
| 8613846 | Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar +2 more | 2013-12-24 |