Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7504148 | Printed circuit board structure and manufacturing method thereof | Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Hsin-Lung Kuo, Wei-Chung Hsiao | 2009-03-17 |
| 7427807 | Chip heat dissipation structure and manufacturing method | Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Ping-Feng Lee, Hsin-Lung Kuo +1 more | 2008-09-23 |