Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7504148 | Printed circuit board structure and manufacturing method thereof | Yu-Chiang Cheng, Chao-Yi Chen, Hsin-Lung Kuo, Bin-Wei Lee, Wei-Chung Hsiao | 2009-03-17 |
| 7427807 | Chip heat dissipation structure and manufacturing method | Yu-Chiang Cheng, Chao-Yi Chen, Ping-Feng Lee, Hsin-Lung Kuo, Bin-Wei Lee +1 more | 2008-09-23 |