Issued Patents All Time
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11449247 | Periphery shoreline augmentation for integrated circuits | Curtis Wortman, Jeffrey Erik Schulz | 2022-09-20 |
| 11442878 | Memory sequencer system and a method of memory sequencing using thereof | Soon Chieh Lim | 2022-09-13 |
| 11373694 | Generic physical layer providing a unified architecture for interfacing with an external memory device and methods of interfacing with an external memory device | Soon Chieh Lim, Tat Hin Tan | 2022-06-28 |
| 11349481 | I/O transmitter circuitry for supporting multi-modes serialization | Selvakumar Sivarajah, Soon Chieh Lim, Tze Jian CHOW | 2022-05-31 |
| 11301412 | Scaling interface architecture between memory and programmable logic | — | 2022-04-12 |
| 11226925 | Scalable 2.5D interface circuitry | Arifur Rahman | 2022-01-18 |
| 11216397 | Translation circuitry for an interconnection in an active interposer of a semiconductor package | Lai Guan Tang, Ankireddy Nalamalpu, Dheeraj Subbareddy, MD Altaf Hossain | 2022-01-04 |
| 11194757 | Scalable 2.5D interface circuitry | Arifur Rahman | 2021-12-07 |
| 11188255 | Dynamic major mode for efficient memory traffic control | Yu Ying Ong, Kevin Chao Ing Teoh | 2021-11-30 |
| 11157440 | Scalable 2.5D interface circuitry | Arifur Rahman | 2021-10-26 |
| 11093261 | Application-based dynamic heterogeneous many-core systems and methods | Kenneth Chong Yin Tan | 2021-08-17 |
| 11080449 | Modular periphery tile for integrated circuit device | Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang | 2021-08-03 |
| 11062070 | Die to die interconnect structure for modularized integrated circuit devices | Lai Guan Tang | 2021-07-13 |
| 11036660 | Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices | George Chong Hean Ooi, Lai Guan Tang | 2021-06-15 |
| 10936511 | Addressable distributed memory in a programmable logic device | Sean R. Atsatt | 2021-03-02 |
| 10931283 | Integrated circuits having memory with flexible input-output circuits | Chang Kian Tan | 2021-02-23 |
| 10886218 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Seng Leong, Lai Guan Tang, Han Wooi Lim, Hee Kong Phoon | 2021-01-05 |
| 10871906 | Periphery shoreline augmentation for integrated circuits | Curtis Wortman, Jeffrey Erik Schulz | 2020-12-22 |
| 10714163 | Methods for mitigating transistor aging to improve timing margins for memory interface signals | Tat Hin Tan, Tick Sern Loh, Wilfred Wee Kee King, Yu Ying Ong | 2020-07-14 |
| 10665548 | Modular interconnection repair of multi-die package | — | 2020-05-26 |
| 10642946 | Modular periphery tile for integrated circuit device | Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang | 2020-05-05 |
| 10579552 | Interface architecture for master-to-master and slave-to-master communication | — | 2020-03-03 |
| 10552052 | Memory interface circuitry with distributed data reordering capabilities | — | 2020-02-04 |
| 10505544 | Scalable 2.5D interface architecture | — | 2019-12-10 |
| 10482060 | Methods and apparatus for controlling interface circuitry | Arifur Rahman | 2019-11-19 |