Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8717059 | Die having wire bond alignment sensing structures | — | 2014-05-06 |
| 7257038 | Test mode for IPP current measurement for wordline defect detection | Michael Killian, Martin Versen, Grant McNeil, Zach Johnson | 2007-08-14 |