Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8944347 | Deposition nozzle and apparatus for thin film deposition process | — | 2015-02-03 |
| 8896135 | Encapsulation film, package structure utilizing the same, and method for forming the package structure | Ching-Chiun Wang, Kang-Feng Lee, Feng-Yu Tsai, Ming Horn Zheng, Chih-Yung Huang +1 more | 2014-11-25 |
| 8435803 | Method for depositing microcrystalline silicon and monitor device of plasma enhanced deposition | Chen-Chung Du, Sheng-Lang Lee, Muh-Wang Liang, Chia-Hao Chang | 2013-05-07 |
| 7449091 | Wafer electroplating apparatus | Chen-Chung Du, Pang-Ming Chiang, Chih-Yuan Tseng, Muh-Wang Liang, Chih-Cheng Wang +1 more | 2008-11-11 |
| 7238265 | Electroplating apparatus with functions of voltage detection and flow rectification | Chih-Cheng Wang, Chih-Yuan Tseng, Sheng-Lang Lee, Chia-Ming Chen, Pang-Ming Chiang | 2007-07-03 |
| 7021208 | Compress and position apparatus | Chen-Chung Du, Pang-Ming Chiang, Muh-Wang Liang, Yi-Chao Weng | 2006-04-04 |
| 6653245 | Method for liquid phase deposition | Muh-Wang Liang, Pang-Min Chiang, Chen Max, Ching-Fa Yeh | 2003-11-25 |
| 6622883 | Door for wafer container having rotatable cammed member and movable links | Tzong-Ming Wu, Muh-Wang Liang | 2003-09-23 |
| 6398033 | Wafer container with retractable handle | Tzong-Ming Wu, Tien-Lu Ho | 2002-06-04 |
| 6390394 | Nozzle and adjust module | Fu-Ching Tung, Chia-Ming Chen, Jonathan Wang, Peter Mahneke | 2002-05-21 |
| 6220771 | Wafer backside protection apparatus | Fu-Ching Tung, Hong-Ming Chen, Wu-Lang Lin, Chia-Ming Chen, Peter Mahneke +1 more | 2001-04-24 |