Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8896135 | Encapsulation film, package structure utilizing the same, and method for forming the package structure | Ching-Chiun Wang, Kang-Feng Lee, Feng-Yu Tsai, Chih-Yung Huang, Shih-Chin Lin +1 more | 2014-11-25 |