WC

William T. Chen

IBM: 16 patents #6,952 of 70,183Top 10%
AE Advanced Semiconductor Engineering: 10 patents #114 of 1,073Top 15%
AR Agency For Science, Technology And Research: 3 patents #337 of 2,337Top 15%
IE Institute Of Materials Research And Engineering: 1 patents #14 of 38Top 40%
NS National University Of Singapore: 1 patents #498 of 1,623Top 35%
SE Sematech: 1 patents #38 of 123Top 35%
📍 Endicott, NY: #11 of 620 inventorsTop 2%
🗺 New York: #3,824 of 115,490 inventorsTop 4%
Overall (All Time): #118,238 of 4,157,543Top 3%
31
Patents All Time

Issued Patents All Time

Showing 26–31 of 31 patents

Patent #TitleCo-InventorsDate
5773132 Protecting copper dielectric interface from delamination Lawrence Robert Blumberg, Mark D. Poliks 1998-06-30
5758979 Printer cartridge ribbon inking system 1998-06-02
5709336 Method of forming a solderless electrical connection with a wirebond chip Anthony P. Ingraham 1998-01-20
5442144 Multilayered circuit board Thomas P. Gall, James R. Wilcox, Tien Y. Wu 1995-08-15
5359767 Method of making multilayered circuit board Thomas P. Gall, James R. Wilcox, Tien Y. Wu 1994-11-01
4906803 Flexible supporting cable for an electronic device and method of making same Stanley M. Albrechta, Francis Charles Burns, Gary R. Carden, Andrew R. Gresko, John J. Kaufman +2 more 1990-03-06