Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831783 | Power converter using near-load output capacitance, direct inductor contact, and/or remote current sense | Paul W. Coteus, Andrew Ferencz, Shawn A. Hall, Todd E. Takken, Xin Zhang | 2017-11-28 |
| 9678289 | Thermal management of optical coupling systems | Mark D. Schultz | 2017-06-13 |
| 9634959 | High-density, fail-in-place switches for computer and data networks | Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Mark D. Schultz, Todd E. Takken | 2017-04-25 |
| 9570373 | Near-chip compliant layer for reducing perimeter stress during assembly process | Mark D. Schultz, Todd E. Takken, Yuan Yao | 2017-02-14 |
| 9342121 | Cooling system for electronic components | William J. Anderl, Evan G. Colgan, James D. Gerken, Christopher M. Marroquin | 2016-05-17 |
| 9213378 | Cooling system for electronic components | William J. Anderl, Evan G. Colgan, James D. Gerken, Christopher M. Marroquin | 2015-12-15 |
| 8571847 | Efficiency of static core turn-off in a system-on-a-chip with variation | Chen-Yong Cher, Paul W. Coteus, Alan Gara, Eren Kursun, David P. Paulsen +2 more | 2013-10-29 |
| 8549363 | Reliability and performance of a system-on-a-chip by predictive wear-out based activation of functional components | Chen-Yong Cher, Paul W. Coteus, Alan Gara, Eren Kursun, David P. Paulsen +2 more | 2013-10-01 |
| 8081473 | Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages | Thomas M. Cipolla, Evan G. Colgan, Paul W. Coteus, Shawn A. Hall | 2011-12-20 |
| 8004841 | Method and apparatus of water cooling several parallel circuit cards each containing several chip packages | Thomas M. Cipolla, Evan G. Colgan, Paul W. Coteus, Shawn A. Hall | 2011-08-23 |
| 7715197 | Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs) | Thomas M. Cipolla, Paul W. Coteus | 2010-05-11 |
| 7486513 | Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling | Shawn A. Hall, Paul W. Coteus, John P. Karidis, Evan G. Colgan, Robert W. Guernsey, Jr. | 2009-02-03 |
| 7474529 | Folded-sheet-metal heatsinks for closely packaged heat-producing devices | Shawn A. Hall, Paul W. Coteus | 2009-01-06 |
| 7342789 | Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling | Shawn A. Hall, Paul W. Coteus, John P. Karidis, Evan G. Colgan, Robert W. Guernsey, Jr. | 2008-03-11 |