Issued Patents All Time
Showing 201–212 of 212 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5480841 | Process of multilayer conductor chip packaging | Harry R. Bickford, Linda C. Matthew | 1996-01-02 |
| 5461455 | Optical system for the projection of patterned light onto the surfaces of three dimensional objects | Douglas S. Goodman | 1995-10-24 |
| 5421079 | High density, high performance memory circuit package | Thomas M. Cipolla, Alphonso P. Lanzetta | 1995-06-06 |
| 5399902 | Semiconductor chip packaging structure including a ground plane | Harry R. Bickford, Linda C. Matthew | 1995-03-21 |
| 5394121 | Wiring topology for transfer of electrical signals | Thomas M. Cipolla, William R. Hardell, Jr. | 1995-02-28 |
| 5343366 | Packages for stacked integrated circuit chip cubes | Thomas M. Cipolla, Ioannis Damianakis, Glen Walden Johnson, Peter G. Ledermann, Linda C. Matthew +1 more | 1994-08-30 |
| 5337218 | Circuit card interconnecting structure | Thomas M. Cipolla | 1994-08-09 |
| 5268815 | High density, high performance memory circuit package | Thomas M. Cipolla, Brian C. Derdall, Christina M. Knoedler, Alphonso P. Lanzetta, John J. Liutkus +3 more | 1993-12-07 |
| 5266520 | Electronic packaging with varying height connectors | Thomas M. Cipolla, Robert H. Katyl, Robert Kelleher, Paul A. Moskowitz | 1993-11-30 |
| 5208729 | Multi-chip module | Thomas M. Cipolla, Glen Walden Johnson, Lawrence S. Mok | 1993-05-04 |
| 5173763 | Electronic packaging with varying height connectors | Thomas M. Cipolla, Robert H. Katyl, Robert Kelleher, Paul A. Moskowitz | 1992-12-22 |
| 5113565 | Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames | Thomas M. Cipolla, Glen Walden Johnson, Philip Murphy, Christopher Oden | 1992-05-19 |