Issued Patents All Time
Showing 151–175 of 267 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8789385 | Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2014-07-29 |
| 8783052 | Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2014-07-22 |
| 8760863 | Multi-rack assembly with shared cooling apparatus | Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2014-06-24 |
| 8743545 | Thermal expansion-enhanced heat sink for an electronic assembly | Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons +1 more | 2014-06-03 |
| 8739406 | Vapor condenser with three-dimensional folded structure | Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2014-06-03 |
| 8734007 | Calibrated airflow sensor facilitating monitoring of electronic system cooling | Thomas C. Long, Robert B. Schlak, Peter A. Wendling | 2014-05-27 |
| 8720063 | Thermal expansion-enhanced heat sink for an electronic assembly | Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madnusudan K. Iyengar, Robert E. Simons +1 more | 2014-05-13 |
| 8713957 | Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s) | Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2014-05-06 |
| 8713955 | Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus | Richard C. Chu, Evan G. Colgan, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more | 2014-05-06 |
| 8711563 | Dry-cooling unit with gravity-assisted coolant flow | Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2014-04-29 |
| 8689861 | Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2014-04-08 |
| 8619425 | Multi-fluid, two-phase immersion-cooling of electronic component(s) | Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2013-12-31 |
| 8583290 | Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2013-11-12 |
| 8564952 | Flow boiling heat sink structure with vapor venting and condensing | Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Robert E. Simons | 2013-10-22 |
| 8550702 | Calibrated airflow sensor facilitating monitoring of electronic system cooling | Thomas C. Long, Robert B. Schlak, Peter A. Wendling | 2013-10-08 |
| 8490679 | Condenser fin structures facilitating vapor condensation cooling of coolant | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2013-07-23 |
| 8472182 | Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2013-06-25 |
| 8387249 | Apparatus and method for facilitating servicing of a liquid-cooled electronics rack | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons, Prabjit Singh | 2013-03-05 |
| 8369091 | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2013-02-05 |
| 8351206 | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2013-01-08 |
| 8345423 | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2013-01-01 |
| 8322029 | Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof | Richard C. Chu, Michael J. Ellsworth, Jr., Keith F. Fogel, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2012-12-04 |
| 8322154 | Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2012-12-04 |
| 8274790 | Automatically reconfigurable liquid-cooling apparatus for an electronics rack | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Randall G. Kemink, Robert E. Simons | 2012-09-25 |
| 8266802 | Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins | Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons | 2012-09-18 |