| 6837777 |
Wafer edge cleaning utilizing polish pad material |
Uldis A. Ziemins, Donald J. Delehanty, Raymond M. Khoury |
2005-01-04 |
| 6622334 |
Wafer edge cleaning utilizing polish pad material |
Uldis A. Ziemins, Donald J. Delehanty, Raymond M. Khoury |
2003-09-23 |
| 6620029 |
Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces |
Raymond M. Khoury, Uldis A. Ziemins |
2003-09-16 |
| 6467120 |
Wafer cleaning brush profile modification |
Uldis A. Ziemins, Raymond M. Khoury, David A. Goodwin |
2002-10-22 |
| 6343974 |
Real-time method for profiling and conditioning chemical-mechanical polishing pads |
Daniel L. Franca, Raymond M. Khoury, Uldis A. Ziemins |
2002-02-05 |
| 6334230 |
Wafer cleaning apparatus |
Raymond M. Khoury, Marc Mattaroccia |
2002-01-01 |
| 6227948 |
Polishing pad reconditioning via polishing pad material as conditioner |
Raymond M. Khoury, Robert M. Merkling, Jr., Uldis A. Ziemins |
2001-05-08 |
| 6217422 |
Light energy cleaning of polishing pads |
Daniel L. Franca, Raymond M. Khoury, Uldis A. Ziemins |
2001-04-17 |
