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Validation of electrical performance of an electronic package prior to fabrication |
Timothy W. Budell, Patrick H. Buffett |
2012-01-31 |
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Method, apparatus and computer program product for electrical package modeling |
Charles S. Chiu |
2010-10-05 |
| 7765509 |
Auto connection assignment system and method |
Adam Matthew Bittner, Timothy W. Budell, Robert Cusimano, Richard Dauphin, Matthew T. Guzowski +2 more |
2010-07-27 |
| 7454723 |
Validation of electrical performance of an electronic package prior to fabrication |
Timothy W. Budell, Patrick H. Buffet |
2008-11-18 |
| 7275229 |
Auto connection assignment system and method |
Adam Matthew Bittner, Timothy W. Budell, Robert Cusimano, Richard Dauphin, Matthew T. Guzowski +2 more |
2007-09-25 |
| 7000203 |
Efficient and comprehensive method to calculate IC package or PCB trace mutual inductance using circular segments and lookup tables |
Patrick H. Buffet, Charles S. Chiu, Gustina B. Collins |
2006-02-14 |
| 6978214 |
Validation of electrical performance of an electronic package prior to fabrication |
Timothy W. Budell, Patrick H. Buffet |
2005-12-20 |
| 6606732 |
Method for specifying, identifying, selecting or verifying differential signal pairs on IC packages |
Patrick H. Buffet, Joseph Natonio |
2003-08-12 |
