Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7223691 | Method of forming low resistance and reliable via in inter-level dielectric interconnect | Cyril Cabral, Jr., Lawrence A. Clevenger, Timothy J. Dalton, Patrick W. DeHaven, Chester T. Dziobkowski +4 more | 2007-05-29 |