Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7731504 | Printed board with component mounting pin | Toshiki Furutani, Takeshi Kawanishi | 2010-06-08 |
| 7692267 | Package substrate with built-in capacitor and manufacturing method thereof | — | 2010-04-06 |
| 7662694 | Capacitor having adjustable capacitance, and printed wiring board having the same | Hajime Sakamoto, Yasuhiko Mano | 2010-02-16 |
| 7656032 | Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module | Masaya Nishikawa | 2010-02-02 |
| 7649748 | Multilayer printed wiring board | Hironori Tanaka | 2010-01-19 |
| RE40947 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole | Motoo Asai, Kenichi Shimada, Kouta Noda, Hiroshi Segawa | 2009-10-27 |
| 7525175 | Package substrate with built-in capacitor and manufacturing method thereof | — | 2009-04-28 |
| 7525190 | Printed wiring board with wiring pattern having narrow width portion | Naohiro Hirose, Yoji Mori | 2009-04-28 |
| 7497694 | Printed board with a pin for mounting a component | Toshiki Furutani, Takeshi Kawanishi | 2009-03-03 |
| 7495332 | Multilayer printed wiring board | Toshiki Furutani, Hirofumi Goto, Shin-ichiro Iwanaga | 2009-02-24 |
| 7489521 | Multilayer printed wiring board | Toshiki Furutani | 2009-02-10 |
| 7480150 | Printed wiring board and method of manufacturing the same | Akira Mochida | 2009-01-20 |
| 7462784 | Heat resistant substrate incorporated circuit wiring board | Toshiki Furutani, Takeshi Kawanishi | 2008-12-09 |
| 7435910 | Multilayer printed circuit board | Hajime Sakamoto, Tadashi Sugiyama, Dongdong Wang | 2008-10-14 |
| 7375289 | Multi-layer printed wiring board including an alignment mark as an index for a position of via holes | Yasuji Hiramatsu, Motoo Asai, Naohiro Hirose | 2008-05-20 |
| 7332816 | Method of fabricating crossing wiring pattern on a printed circuit board | Naohiro Hirose, Yoji Mori | 2008-02-19 |
| 7262975 | Multilayer printed wiring board | Toshiki Furutani | 2007-08-28 |
| 7127812 | Process for producing a multi-layer printed wiring board | Yasuji Hiramatsu, Motoo Asai, Naohiro Hirose | 2006-10-31 |
| 7049528 | Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module | Masaya Nishikawa | 2006-05-23 |
| 6909054 | Multilayer printed wiring board and method for producing multilayer printed wiring board | Hajime Sakamoto, Tadashi Sugiyama, Dongdong Wang | 2005-06-21 |
| 6889433 | Method of manufacturing printed-circuit board | Ryo Enomoto, Hajime Sakamoto | 2005-05-10 |
| 6762921 | Multilayer printed-circuit board and method of manufacture | Motoo Asai, Kouta Noda | 2004-07-13 |
| 6609297 | Method of manufacturing multilayer printed wiring board | Yasuji Hiramatsu, Motoo Asai, Naohiro Hirose | 2003-08-26 |
| 6534723 | Multilayer printed-circuit board and semiconductor device | Motoo Asai | 2003-03-18 |
| 6440542 | Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same | — | 2002-08-27 |