Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5294567 | Method for forming via holes in multilayer circuits | Jay Robert Dorfman, Richard R. Draudt, Thomas D. Lantzer, David L. Sutton | 1994-03-15 |
| 4982267 | Integrated semiconductor package | Xavier Sheehy, Richard K. Spielberger | 1991-01-01 |
| 4498954 | Selective process for etching chromium | Dennis L. Huston, Vahram S. Kardashian | 1985-02-12 |
| 4354311 | Solderable conductor composition and a method of soldering a lead to a lead pad | Donald Neuhoff, Kit M. Lam | 1982-10-19 |
| 4332624 | Method of cleaning a fired thick film copper layer | Jay P. Page | 1982-06-01 |
| 4299876 | Solderable conductor pattern | Donald Neuhoff, Kit M. Lam | 1981-11-10 |
| 4295271 | Method of soldering a lead to a sintered lead pad | Donald Neuhoff, Man K. Lam | 1981-10-20 |
| 4273859 | Method of forming solder bump terminals on semiconductor elements | Jack A. Sartell, Vahram S. Kardashian | 1981-06-16 |