Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7965094 | Packaged die heater | Bruce W. Ohme, Ronald J. Jensen | 2011-06-21 |
| 7863720 | Method and system for stacking integrated circuits | Ronald J. Jensen | 2011-01-04 |
| 7736946 | System and method for sealing a MEMS device | Bryan R. Seppala, Harlan L. Curtis, Jon DCamp | 2010-06-15 |
| 7635916 | Integrated circuit package with top-side conduction cooling | Ronald J. Jensen | 2009-12-22 |
| 7569915 | Shielding arrangement to protect a circuit from stray magnetic fields | Romney R. Katti | 2009-08-04 |
| 7078243 | Shielding arrangement to protect a circuit from stray magnetic fields | Romney R. Katti | 2006-07-18 |
| 6916668 | Methods for providing a magnetic shield for an integrated circuit having magnetoresistive memory cells | Romney R. Katti | 2005-07-12 |
| 6657134 | Stacked ball grid array | Ronald J. Jensen, Thomas Wagner | 2003-12-02 |
| 6611054 | IC package lid for dose enhancement protection | Thomas J. Dunaway | 2003-08-26 |
| 6515352 | Shielding arrangement to protect a circuit from stray magnetic fields | Romney R. Katti | 2003-02-04 |
| 6169254 | Three axis sensor package on flexible substrate | Bharat B. Pant | 2001-01-02 |
| 6027948 | Method to permit high temperature assembly processes for magnetically sensitive devices | Ronald J. Jensen, Allan T. Hurst, Jeff S. Sather | 2000-02-22 |
| 6005778 | Chip stacking and capacitor mounting arrangement including spacers | Ronald J. Jensen, Charles J. Speerschneider | 1999-12-21 |
| 5998867 | Radiation enhanced chip encapsulant | Ronald J. Jensen, Toan Nguyen, William F. M. Jacobsen | 1999-12-07 |
| 5939772 | Shielded package for magnetic devices | Allan T. Hurst | 1999-08-17 |
| 5891745 | Test and tear-away bond pad design | Thomas J. Dunaway | 1999-04-06 |
| 5719748 | Semiconductor package with a bridge for chip area connection | Deborah A. Cullinan, Thomas J. Dunaway | 1998-02-17 |
| 5644230 | Miniature magnetometer and flexible circuit | Bharat B. Pant, Bruce W. Ohme | 1997-07-01 |
| 5498900 | Semiconductor package with weldable ceramic lid | Thomas J. Dunaway | 1996-03-12 |
| 5161729 | Package to semiconductor chip active interconnect site method | Thomas J. Dunaway, Lori A. Dicks, Jerald M. Loy | 1992-11-10 |
| 5139610 | Method of making a surface etched shadow mask | Thomas J. Dunaway | 1992-08-18 |
| 5140496 | Direct microcircuit decoupling | Michael W. Heinks, Thomas J. Dunaway | 1992-08-18 |
| 5101550 | Removable drop-through die bond frame | Thomas J. Dunaway, Lori A. Dicks | 1992-04-07 |
| 5099306 | Stacked tab leadframe assembly | Thomas J. Dunaway, Jerald M. Loy, Lori A. Dicks, Francis J. Belcourt | 1992-03-24 |
| 5074036 | Method of die bonding semiconductor chip by using removable frame | Thomas J. Dunaway, Lori A. Dicks | 1991-12-24 |