Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6611054 | IC package lid for dose enhancement protection | Richard K. Spielberger | 2003-08-26 |
| 5891745 | Test and tear-away bond pad design | Richard K. Spielberger | 1999-04-06 |
| 5874319 | Vacuum die bond for known good die assembly | Deborah A. Cullinan | 1999-02-23 |
| 5773311 | Method for providing a test connection and a permanent connection site on an unpackaged semiconductor die | Deborah A. Cullinan | 1998-06-30 |
| 5719748 | Semiconductor package with a bridge for chip area connection | Deborah A. Cullinan, Richard K. Spielberger | 1998-02-17 |
| 5498900 | Semiconductor package with weldable ceramic lid | Richard K. Spielberger | 1996-03-12 |
| 5161729 | Package to semiconductor chip active interconnect site method | Richard K. Spielberger, Lori A. Dicks, Jerald M. Loy | 1992-11-10 |
| 5139610 | Method of making a surface etched shadow mask | Richard K. Spielberger | 1992-08-18 |
| 5140496 | Direct microcircuit decoupling | Michael W. Heinks, Richard K. Spielberger | 1992-08-18 |
| 5101550 | Removable drop-through die bond frame | Richard K. Spielberger, Lori A. Dicks | 1992-04-07 |
| 5099306 | Stacked tab leadframe assembly | Richard K. Spielberger, Jerald M. Loy, Lori A. Dicks, Francis J. Belcourt | 1992-03-24 |
| 5074036 | Method of die bonding semiconductor chip by using removable frame | Richard K. Spielberger, Lori A. Dicks | 1991-12-24 |
| 5066614 | Method of manufacturing a leadframe having conductive elements preformed with solder bumps | Richard K. Spielberger, Lori A. Dicks, Jerald M. Loy | 1991-11-19 |
| 5066831 | Universal semiconductor chip package | Richard K. Spielberger | 1991-11-19 |
| 5036163 | Universal semiconductor chip package | Richard K. Spielberger | 1991-07-30 |
| 5010387 | Solder bonding material | Richard K. Spielberger, Lori A. Dicks, Jerald M. Loy | 1991-04-23 |
| 4999700 | Package to board variable pitch tab | Richard K. Spielberger, James M. Poplett | 1991-03-12 |
| 4979289 | Method of die bonding semiconductor chip by using removable non-wettable by solder frame | Richard K. Spielberger, Lori A. Dicks | 1990-12-25 |
| 4980240 | Surface etched shadow mask | Richard K. Spielberger | 1990-12-25 |
| 4980753 | Low-cost high-performance semiconductor chip package | Richard K. Spielberger, Lori A. Dicks | 1990-12-25 |
| 4948032 | Fluxing agent | Richard K. Spielberger, Lori A. Dicks | 1990-08-14 |
| 4898320 | Method of manufacturing a high-yield solder bumped semiconductor wafer | Richard K. Spielberger, Lori A. Dicks | 1990-02-06 |
| 4892245 | Controlled compression furnace bonding | Richard K. Speilberger, Jerald M. Loy, Lori A. Dicks, Luverne O. Balgaard | 1990-01-09 |
| 4528446 | Optoelectronic lens array with an integrated circuit | Richard K. Spielberger, John C. Wittenberger | 1985-07-09 |