Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903148 | High performance multi-component electronics power module | — | 2021-01-26 |
| 10553524 | Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad | — | 2020-02-04 |
| 5138115 | Carrierles surface mounted integrated circuit die | — | 1992-08-11 |
| 5137836 | Method of manufacturing a repairable multi-chip module | — | 1992-08-11 |
| 5079835 | Method of forming a carrierless surface mounted integrated circuit die | — | 1992-01-14 |
| 5031462 | Snap-fit construction low cost pressure sensing device | — | 1991-07-16 |
| 4942383 | Low cost wet-to-wet pressure sensor package | Milton W. Mathias | 1990-07-17 |
| 4295271 | Method of soldering a lead to a sintered lead pad | Donald Neuhoff, Arthur H. Mones | 1981-10-20 |