Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5294567 | Method for forming via holes in multilayer circuits | Jay Robert Dorfman, Thomas D. Lantzer, Arthur H. Mones, David L. Sutton | 1994-03-15 |
| 5228946 | Multi-plate lamination fixture | — | 1993-07-20 |