Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5276586 | Bonding structure of thermal conductive members for a multi-chip module | Toshio Hatsuda, Takahiro Daikoku, Tetsuya Hayashida, Noriyuki Ashiwake, Fumiyuki Kobayashi +1 more | 1994-01-04 |