Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9779976 | Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor | Satoshi Ikeo, Toshifumi Sagawa, Ryosuke Doi, Hiroshi Kikuchi | 2017-10-03 |
| 6774490 | Electronic device | Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita +4 more | 2004-08-10 |
| 6761301 | Soldering machine | Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro YAMASHITA +2 more | 2004-07-13 |
| 6555052 | Electron device and semiconductor device | Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita +4 more | 2003-04-29 |
| 6541364 | Bump forming method and bump forming apparatus | Jun Matsui, Kaoru Uchiyama, Takayuki Itsuji, Kunio Kondo | 2003-04-01 |
| 6412681 | Soldering machine | Kazumi Tashiro, Hideaki Arita, Kiyoshi Kanai, Teruo Okano, Fumihiro YAMASHITA +2 more | 2002-07-02 |