Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE40139 | Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer | Hisashi Maejima, Hiroshi Nishizuka, Susumu Komoriya | 2008-03-04 |
| 5279992 | Method of producing a wafer having a curved notch | Hisashi Maejima, Hiroshi Nishizuka, Susumu Komoriya | 1994-01-18 |
| 5230747 | Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer | Hisashi Maejima, Hiroshi Nishizuka, Susumu Komoriya | 1993-07-27 |
| 4783225 | Wafer and method of working the same | Hisashi Maejima, Hiroshi Nishizuka, Susumu Komoriya | 1988-11-08 |