Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8119737 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2012-02-21 |
| 7947779 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2011-05-24 |
| 7070670 | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device | Takeo Tomiyama, Teiichi Inada, Masaaki Yasuda, Keiichi Hatakeyama, Yuuji Hasegawa +8 more | 2006-07-04 |