Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5098999 | Amino-protected dopa derivative and production thereof | Yasuo Yamamoto | 1992-03-24 |
| 4985509 | Heat curable resin composition | Hidekazu Matuura, Toshihiko Kato | 1991-01-15 |
| 4833204 | Epoxy resin composition for a copper-clad laminate | Masami Yusa, Katsuji Shibata | 1989-05-23 |
| 4707316 | Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer | Atsushi Fujioka, Tomio Fukuda | 1987-11-17 |
| 4598115 | Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer | Atsushi Fujioka, Tomio Fukuda | 1986-07-01 |
| 4528223 | Composite fibrous product | Tetsuo Kumazawa, Hiroaki Doi, Atsushi Fujioka, Tadashi Nagai | 1985-07-09 |
| 4526838 | Polyamino-bis-imide resin | Atsushi Fujioka, Tomio Fukuda | 1985-07-02 |
| 4511681 | Process for producing a polyimide solution | Masatoshi Yoshida | 1985-04-16 |
| 4510008 | Continuous production of copper-clad laminate | Ikuo Hoshi, Masami Arai, Kiyoshi Yokochi, Atsushi Fujioka, Takehisa Nakagawa | 1985-04-09 |
| 4485234 | Method of preparing polyamide acid for processing of semiconductors | Daisuke Makino | 1984-11-27 |
| 4447596 | Method of preparing polyamide acid for processing of semiconductors | Daisuke Makino | 1984-05-08 |
| 4446191 | Laminates comprising prepregs metal clad | Atsushi Fujioka, Tetsuo Kumazawa | 1984-05-01 |
| 4225702 | Method of preparing polyamide acid type intermediates for processing of semiconductors | Daisuke Makino, Seiki Harada, Atsushi Saiki | 1980-09-30 |