Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8991983 | Provide heat to end regions of a printhead die | Michael Hager, Alexander Govyadinov | 2015-03-31 |
| 8944549 | Nozzle layouts for printheads | Dustin Blair, Sean P. McClelland | 2015-02-03 |
| 8939552 | Thermal fluid-ejection echanism having heating resistor on cavity sidewalls | Peter Mardilovich, Erik D. Torniainen | 2015-01-27 |
| 8919928 | Fluid ejection device having firing chamber with mesa | Peter Mardilovich, Erik D. Torniainen, James A. Feinn, Thomas R. Strand, Tony S. Cruz-Uribe | 2014-12-30 |
| 8870351 | Heating resistor | Peter Mardilovich, Erik D. Torniainen | 2014-10-28 |
| 8783831 | Fluid ejection device having firing chamber with contoured floor | Peter Mardilovich, Erik D. Torniainen | 2014-07-22 |
| 8444255 | Power distribution in a thermal ink jet printhead | Chris Bakker, Bjorn Warloe, Reynaldo V Villavelez, Paul I. Mikulan, Kenneth J. Stewart +4 more | 2013-05-21 |
| 8382255 | Thermal inkjet printhead with heating element in recessed substrate cavity | Peter Mardilovich | 2013-02-26 |
| 7942997 | High resolution inkjet printer | Rio Rivas, Ed Friesen, John B. Rausch | 2011-05-17 |
| 7669314 | Method of fabricating a fluid ejection device having a data storage structure | James A. Feinn, Satya Prakash, Donald W. Schulte, Terry McMahon, Adam L. Ghozeil | 2010-03-02 |
| 7377618 | High resolution inkjet printer | Rio Rivas, Ed Friesen, John B. Rausch | 2008-05-27 |
| 7249825 | Fluid ejection device with data storage structure | James A. Feinn, Satya Prakash, Donald W. Schulte, Terry McMahon, Adam L. Ghozeil | 2007-07-31 |
| 6782621 | Method of fabricating a fluid ejector | Matthew Giere, Timothy L. Weber | 2004-08-31 |
| 6561632 | Printhead with high nozzle packing density | James A. Feinn, Colin C. Davis | 2003-05-13 |
| 6554404 | Conductor routing for a printhead | Matthew Giere, Timothy L. Weber | 2003-04-29 |
| 6543879 | Inkjet printhead assembly having very high nozzle packing density | James A. Feinn, Winthrop D. Childers, Clayton L. Holstun, Matthew Giere, Colin C. Davis | 2003-04-08 |
| 6523940 | Carrier for fluid ejection device | Joseph E. Scheffelin, Janis Horvath, Brian J. Keefe, Ali Emamjomeh, Paul Mark Haines | 2003-02-25 |
| 6464333 | Inkjet printhead assembly with hybrid carrier for printhead dies | Joseph E. Scheffelin, Janis Horvath, Brian J. Keefe, Ali Emamjomeh, Paul Mark Haines | 2002-10-15 |
| 6375307 | Printing apparatus and method | Lluis Vinals, Salvador Sanchez | 2002-04-23 |
| 6341845 | Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies | Joseph E. Scheffelin, Janis Horvath, Brian J. Keefe, Ali Emamjomeh, Paul Mark Haines | 2002-01-29 |
| 5798285 | Method of making electronic module with multiple solder dams in soldermask window | Mark Rudolf Bentlage, Kenneth Michael Fallon | 1998-08-25 |
| 5729440 | Solder hierarchy for chip attachment to substrates | Miguel A. Jimarez, Amit K. Sarkhel | 1998-03-17 |
| 5655703 | Solder hierarchy for chip attachment to substrates | Miguel A. Jimarez, Amit K. Sarkhel | 1997-08-12 |
| 5650595 | Electronic module with multiple solder dams in soldermask window | Mark Rudolf Bentlage, Kenneth Michael Fallon | 1997-07-22 |
| 5535526 | Apparatus for surface mounting flip chip carrier modules | — | 1996-07-16 |