Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7004375 | Pre-applied fluxing underfill composition having pressure sensitive adhesive properties | Brian Wheelock, Quinn K. Tong | 2006-02-28 |
| 6978540 | Method for pre-applied thermoplastic reinforcement of electronic components | Paul Morganelli, David Peard, Douglas Katze | 2005-12-27 |
| 6624216 | No-flow underfill encapsulant | Paul Morganelli, Anthony DeBarros, Brian Wheelock | 2003-09-23 |
| 5962134 | Aminoplast- and phenoplast- resin encapsulated particles | Alice M. Simon, Robin D. O'Dell | 1999-10-05 |
| 5851034 | Pipe swivel joint with removable plug for main seal replacement | — | 1998-12-22 |
| 5753799 | Life cycle testing of swivel joints | — | 1998-05-19 |
| 5728797 | Method of making cured resin particles | Robin D. O'Dell, Alice M. Simon | 1998-03-17 |
| 5545476 | Wear resistant glossy laminates | Robin D. O'Dell, Joseph A. Lex, Alice M. Simon | 1996-08-13 |