Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7047633 | Method of using pre-applied underfill encapsulant | Paul Morganelli, Jayesh Shah | 2006-05-23 |
| 6978540 | Method for pre-applied thermoplastic reinforcement of electronic components | Paul Morganelli, Jayesh Shah, Douglas Katze | 2005-12-27 |