Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9441070 | Divinylarene dioxide compositions having reduced volatility | — | 2016-09-13 |
| 7047633 | Method of using pre-applied underfill encapsulant | Jayesh Shah, David Peard | 2006-05-23 |
| 6978540 | Method for pre-applied thermoplastic reinforcement of electronic components | David Peard, Jayesh Shah, Douglas Katze | 2005-12-27 |
| 6624216 | No-flow underfill encapsulant | Anthony DeBarros, Brian Wheelock, Jayesh Shah | 2003-09-23 |
| 5672677 | Long open time polyamide compositions | Douglas E. Frost | 1997-09-30 |
| 5454909 | Low-density hot melt adhesive | — | 1995-10-03 |