Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7004375 | Pre-applied fluxing underfill composition having pressure sensitive adhesive properties | Jayesh Shah, Quinn K. Tong | 2006-02-28 |
| 6624216 | No-flow underfill encapsulant | Paul Morganelli, Anthony DeBarros, Jayesh Shah | 2003-09-23 |