Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7279785 | Stacked die package system | Jong-Woo Ha, Myung Kil Lee, Taebok Jung | 2007-10-09 |
| 7279786 | Nested integrated circuit package on package system | — | 2007-10-09 |
HK
Hyun Uk Kim
Hanmi Pharm. Co.: 11 patents #16 of 212Top 8%
Stats Chippac: 4 patents #148 of 425Top 35%
Korea Institute Of Energy Research: 3 patents #199 of 702Top 30%
Center For Advanced Meta-Materials: 1 patents #25 of 71Top 40%
National Institute Of Meteorological Sciences: 1 patents #28 of 78Top 40%
Hanmi Science Co.: 1 patents #82 of 140Top 60%
Overall (All Time): #141,977 of 4,157,543Top 4%
27
Patents All Time