Issued Patents All Time
Showing 26–50 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9543256 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Kenshi Fukumitsu | 2017-01-10 |
| 9334163 | Hydrogen storage method | Tomomi Kanai, Kazumi Harada | 2016-05-10 |
| 9302410 | Method for cutting object to be processed | Hideki Shimoi, Daisuke Kawaguchi | 2016-04-05 |
| 9287177 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Kenshi Fukumitsu | 2016-03-15 |
| 9142458 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Kenshi Fukumitsu | 2015-09-22 |
| 8969761 | Method of cutting a wafer-like object and semiconductor chip | Fumitsugu Fukuyo, Kenshi Fukumitsu, Toshimitsu Wakuda | 2015-03-03 |
| 8969752 | Laser processing method | Kenshi Fukumitsu, Fumitsugu Fukuyo | 2015-03-03 |
| 8946589 | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device | Fumitsugu Fukuyo, Kenshi Fukumitsu, Toshimitsu Wakuda | 2015-02-03 |
| 8946592 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Toshimitsu Wakuda | 2015-02-03 |
| 8946591 | Method of manufacturing a semiconductor device formed using a substrate cutting method | Fumitsugu Fukuyo, Kenshi Fukumitsu, Toshimitsu Wakuda | 2015-02-03 |
| 8937264 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Toshimitsu Wakuda | 2015-01-20 |
| 8933369 | Method of cutting a substrate and method of manufacturing a semiconductor device | Fumitsugu Fukuyo, Kenshi Fukumitsu, Toshimitsu Wakuda | 2015-01-13 |
| 8927900 | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device | Fumitsugu Fukuyo, Kenshi Fukumitsu, Toshimitsu Wakuda | 2015-01-06 |
| 8890026 | Method for cutting processing target | Daisuke Kawaguchi, Hideki Shimoi | 2014-11-18 |
| 8890027 | Laser processing method and laser processing system | Fumitsugu Fukuyo, Etsuji Ohmura, Kenshi Fukumitsu, Masayoshi Kumagai, Kazuhiro Atsumi | 2014-11-18 |
| 8889525 | Substrate dividing method | Yoshimaro Fujii, Fumitsugu Fukuyo, Kenshi Fukumitsu | 2014-11-18 |
| 8871671 | Hydrogen storage unit | Tomomi Kanai, Kazumi Harada | 2014-10-28 |
| 8865566 | Method of cutting semiconductor substrate | Fumitsugu Fukuyo, Kenshi Fukumitsu, Ryuji Sugiura | 2014-10-21 |
| 8828306 | Working object cutting method | — | 2014-09-09 |
| 8758691 | Hydrogen-absorbing alloy and hydrogen sensor using the alloy | Tomomi Kanai, Kazumi Harada | 2014-06-24 |
| 8716110 | Laser processing method and laser processing apparatus | Fumitsugu Fukuyo, Kenshi Fukumitsu, Toshimitsu Wakuda | 2014-05-06 |
| 8685838 | Laser beam machining method | Fumitsugu Fukuyo, Kenshi Fukumitsu, Toshimitsu Wakuda, Kazuhiro Atsumi, Kenichi Muramatsu | 2014-04-01 |
| 8603351 | Working method for cutting | Takeshi Sakamoto, Hideki Shimoi | 2013-12-10 |
| 8551817 | Semiconductor substrate cutting method | Kenshi Fukumitsu, Fumitsugu Fukuyo, Ryuji Sugiura, Kazuhiro Atsumi | 2013-10-08 |
| 8541251 | Method for manufacturing light-emitting device | — | 2013-09-24 |