Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11162191 | Thermal processing method for silicon wafer | Susumu Maeda, Hironori Banba, Haruo Sudo, Hideyuki Okamura, Koji Araki +1 more | 2021-11-02 |
| 10648101 | Silicon wafer | Susumu Maeda, Hironori Banba, Haruo Sudo, Hideyuki Okamura, Koji Araki +1 more | 2020-05-12 |
| 7397110 | High resistance silicon wafer and its manufacturing method | Nobumitsu Takase, Hideshi Nishikawa, Makoto Ito, Shinsuke Sadamitsu | 2008-07-08 |
| 7316745 | High-resistance silicon wafer and process for producing the same | Shinsuke Sadamitsu, Nobumitsu Takase, Hiroyuki Takao, Masataka Horai | 2008-01-08 |
| 6803242 | Evaluation method of IG effectivity in semiconductor silicon substrates | Takayuki Kihara, Shinsuke Sadamitsu | 2004-10-12 |
| 5691049 | Heat shrinkable polyolefin laminate film | Shuichi Morita, Fumio Horita, Toshikatsu Oyama, Hideo Isozaki | 1997-11-25 |
| 5620803 | Heat shrinkable polypropylene laminate film | Toshikatsu Oyama, Shuichi Morita, Fumio Horita, Hideo Isozaki | 1997-04-15 |