Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043764 | Through silicon via device having low stress, thin film gaps and methods for forming the same | Huang Liu, Chun Yu Wong | 2018-08-07 |
| 9761481 | Integrated circuits and methods of forming the same with metal layer connection to through-semiconductor via | Chun Yu Wong, Percival Rayo | 2017-09-12 |
| 9658531 | Semiconductor device resolution enhancement by etching multiple sides of a mask | Guoxiang Ning, Chunyu WONG, Paul Ackmann | 2017-05-23 |
| 9455188 | Through silicon via device having low stress, thin film gaps and methods for forming the same | Huang Liu, Chun Yu Wong | 2016-09-27 |
| 9245790 | Integrated circuits and methods of forming the same with multiple embedded interconnect connection to same through-semiconductor via | Chun Yu Wong | 2016-01-26 |
| 9236301 | Customized alleviation of stresses generated by through-substrate via(S) | Guoxiang Ning, Xiang Hu, Paul Ackmann | 2016-01-12 |
| 8907496 | Circuit structures and methods of fabrication with enhanced contact via electrical connection | Guoxiang Ning, Xiang Hu, Paul Ackmann | 2014-12-09 |
| 8895211 | Semiconductor device resolution enhancement by etching multiple sides of a mask | Guoxiang Ning, Chunyu WONG, Paul Ackmann | 2014-11-25 |