Issued Patents All Time
Showing 126–150 of 153 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9089071 | Implementing enhanced low loss, thin, high performance flexible circuits | John R. Dangler | 2015-07-21 |
| 9081137 | Implementing embedded hybrid electrical-optical PCB construct | Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil | 2015-07-14 |
| 9060433 | Thermal dissipative retractable flex assembly | John R. Dangler | 2015-06-16 |
| 9032617 | Method for manufacturing split flex cable | David J. Braun, Mark G. Clark, John R. Dangler, Thomas D. Kidd, Jason T. Stoll | 2015-05-19 |
| 8995801 | Planar coaxial electrically and optically conductive structure | Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil | 2015-03-31 |
| 8968987 | Implementing enhanced optical mirror coupling and alignment utilizing two-photon resist | Emmanuel Atta, Darcy Berger, John R. Dangler, Jesse Hefner, Thomas W. Liang | 2015-03-03 |
| 8965159 | Implementing twisted pair waveguide for electronic substrates | Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil | 2015-02-24 |
| 8863046 | Controlling impedance and thickness variations for multilayer electronic structures | John R. Dangler | 2014-10-14 |
| 8549444 | Controlling impedance and thickness variations for multilayer electronic structures | John R. Dangler | 2013-10-01 |
| 8488968 | Programmable optical interconnect for multi-node computer systems | Emmanuel Atta, Darcy Berger, John R. Dangler, Jesse Hefner, Thomas W. Liang | 2013-07-16 |
| 8434222 | Method to manufacture a circuit apparatus having a rounded differential pair trace | Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil | 2013-05-07 |
| 8251749 | Implementing impedance gradient connector for board-to-board applications | John R. Dangler, Thomas D. Kidd, Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil | 2012-08-28 |
| 8106300 | Split flex cable | David J. Braun, Mark G. Clark, John R. Dangler, Thomas D. Kidd, Jason T. Stoll | 2012-01-31 |
| 8053352 | Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes | Roger A. Booth, Jr. | 2011-11-08 |
| 8015701 | Method of manufacturing a flexible printed circuit assembly | Paul V. Abrahamson, John R. Dangler, Daniel L. Dawiedczyk | 2011-09-13 |
| 7977582 | Flexible multilayer printed circuit assembly with reduced EMI emissions | Mark G. Clark, John R. Dangler, Thomas D. Kidd, Timothy L. McMillan, Jason T. Stoll | 2011-07-12 |
| 7921403 | Controlling impedance and thickness variations for multilayer electronic structures | John R. Dangler | 2011-04-05 |
| 7525299 | Apparatus for accessing and probing the connections between a chip package and a printed circuit board | Paul Rudrud, Roger A. Booth, Jr., John R. Dangler, Jesse Hefner, Ankur Kanu Patel +1 more | 2009-04-28 |
| 7492985 | Flexible printed circuits capable of transmitting electrical and optical signals | John R. Dangler | 2009-02-17 |
| 7454096 | Flexible printed circuits capable of transmitting electrical and optical signals | John R. Dangler | 2008-11-18 |
| 7360188 | Method and apparatus for characteristics impedance discontinuity reduction in high-speed flexible circuit applications | — | 2008-04-15 |
| 7353130 | Method and apparatus for implementing automatic-calibration of TDR probing system | Roger A. Booth, Jr., Lynn Robert Landin, Thomas W. Liang, Ankur Kanu Patel | 2008-04-01 |
| 7308661 | Method and apparatus for characteristic impedance discontinuity reduction in high-speed flexible circuit applications | — | 2007-12-11 |
| 7299144 | Method and apparatus for implementing automatic-calibration of TDR probing system | Roger A. Booth, Jr., Lynn Robert Landin, Thomas W. Liang, Ankur Kanu Patel | 2007-11-20 |
| 7272809 | Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design | Darryl J. Becker, Daniel Douriet, Andrew Benson Maki, Joel D. Ziegelbein | 2007-09-18 |