| 8293609 |
Method of manufacturing a transistor device having asymmetric embedded strain elements |
Rohit Pal, Michael Hargrove |
2012-10-23 |
| 8217463 |
Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods |
Rohit Pal, Michael Hargrove |
2012-07-10 |
| 8193592 |
MOSFET with asymmetrical extension implant |
Andrew Waite, Scott Luning |
2012-06-05 |
| 8148750 |
Transistor device having asymmetric embedded strain elements and related manufacturing method |
Rohit Pal, Michael Hargrove |
2012-04-03 |
| 8076209 |
Methods for fabricating MOS devices having highly stressed channels |
Rohit Pal, Michael Hargrove |
2011-12-13 |
| 8026539 |
Metal oxide semiconductor devices having doped silicon-compromising capping layers and methods for fabricating the same |
Michael Hargrove, Rohit Pal |
2011-09-27 |
| 7994014 |
Semiconductor devices having faceted silicide contacts, and related fabrication methods |
Rohit Pal, Michael Hargrove |
2011-08-09 |
| 7989298 |
Transistor having V-shaped embedded stressor |
Kevin K. Chan, Brian J. Greene, Judson R. Holt, Jeffrey B. Johnson, Thomas S. Kanarsky +4 more |
2011-08-02 |
| 7960229 |
Metal oxide semiconductor transistor with reduced gate height, and related fabrication methods |
Rohit Pal, Scott Luning |
2011-06-14 |
| 7939852 |
Transistor device having asymmetric embedded strain elements and related manufacturing method |
Rohit Pal, Michael Hargrove |
2011-05-10 |
| 7932143 |
Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods |
Rohit Pal, Michael Hargrove |
2011-04-26 |
| 7829401 |
MOSFET with asymmetrical extension implant |
Andrew Waite, Scott Luning |
2010-11-09 |
| 7767534 |
Methods for fabricating MOS devices having highly stressed channels |
Rohit Pal, Michael Hargrove |
2010-08-03 |
| 7670934 |
Methods for fabricating MOS devices having epitaxially grown stress-inducing source and drain regions |
Rohit Pal |
2010-03-02 |
| 7632727 |
Method of forming stepped recesses for embedded strain elements in a semiconductor device |
Rohit Pal, Michael Hargrove |
2009-12-15 |