KS

Koon Chong So

GS General Semiconductor: 42 patents #2 of 38Top 6%
ME Megamos: 13 patents #2 of 9Top 25%
IL Icemos Technology Limited: 4 patents #9 of 11Top 85%
MS Magepower Semiconductor: 3 patents #2 of 9Top 25%
TS Third Dimension (3D) Semiconductor: 2 patents #6 of 7Top 90%
🗺 California: #4,767 of 386,348 inventorsTop 2%
Overall (All Time): #32,107 of 4,157,543Top 1%
67
Patents All Time

Issued Patents All Time

Showing 51–67 of 67 patents

Patent #TitleCo-InventorsDate
6046078 Semiconductor device fabrication with reduced masking steps Fwu-Iuan Hshieh 2000-04-04
6025230 High speed MOSFET power device with enhanced ruggedness fabricated by simplified processes Fwu-Iuan Hshieh 2000-02-15
5998266 Method of forming a semiconductor structure having laterally merged body layer 1999-12-07
5986304 Punch-through prevention in trenched DMOS with poly-silicon layer covering trench corners Fwu-Iuan Hshieh, True-Lon Lin 1999-11-16
5960275 Power MOSFET fabrication process to achieve enhanced ruggedness, cost savings, and product reliability Fwu-Iuan Hshieh 1999-09-28
5923065 Power MOSFET device manufactured with simplified fabrication processes to achieve improved ruggedness and product cost savings Danny Chi Nim, True-Lon Lin, Fwu-Iuan Hshieh, Yan Man Tsui 1999-07-13
5907169 Self-aligned and process-adjusted high density power transistor with gate sidewalls provided with punch through prevention and reduced JFET resistance Fwu-Iuan Hshieh, True-Lon Lin 1999-05-25
5907776 Method of forming a semiconductor structure having reduced threshold voltage and high punch-through tolerance Fwu-Iuan Hshieh 1999-05-25
5895951 MOSFET structure and fabrication process implemented by forming deep and narrow doping regions through doping trenches Yan Man Tsui, Fwu-Iuan Hshieh, True-Lon Lin, Danny Chi Nim 1999-04-20
5883410 Edge wrap-around protective extension for covering and protecting edges of thick oxide layer Fwu-Iuan Hshieh, Danny Chi Nim, Yan Man Tsui 1999-03-16
5883416 Gate-contact structure to prevent contact metal penetration through gate layer without affecting breakdown voltage True-Lon Lin, Fwu-Iuan Hshieh, Yan Man Tsui 1999-03-16
5877529 Mosfet termination design and core cell configuration to increase breakdown voltage and to improve device ruggedness Danny Chi Nim, Fwu-Iuan Hshieh, Yan Man Tsui, True-Lon Lin, Shu-Hui Cheng 1999-03-02
5877528 Structure to provide effective channel-stop in termination areas for trenched power transistors 1999-03-02
5763915 DMOS transistors having trenched gate oxide Fwu-Juan Hshieh, True-Lon Lin, Danny Chi Nim, Yan Man Tsui 1998-06-09
5747853 Semiconductor structure with controlled breakdown protection Fwu-Iuan Hshieh, Danny Chi Nim, True-Lon Line, Yan Man Ysui 1998-05-05
5729037 MOSFET structure and fabrication process for decreasing threshold voltage Fwu-Iuan Hshieh, Yan Man Tsui, True-Lon Lin, Danny Chi Nim 1998-03-17
5668026 DMOS fabrication process implemented with reduced number of masks True-Lon Lin, Fwu-Iuan Hshieh, Danny Chi Nim, Yan Man Tsui 1997-09-16