Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9209151 | Embedded semiconductor device package and method of manufacturing thereof | Shakti Singh Chauhan, Arun Virupaksha Gowda | 2015-12-08 |
| 9184124 | Reliable surface mount integrated power module | Shakti Singh Chauhan, Arun Virupaksha Gowda | 2015-11-10 |
| 9171785 | Power overlay structure with leadframe connections | Arun Virupaksha Gowda | 2015-10-27 |
| 9165864 | Power overlay structure with leadframe connections | Arun Virupaksha Gowda | 2015-10-20 |
| 9117813 | Integrated circuit package and method of making same | Arun Virupaksha Gowda | 2015-08-25 |
| 8987876 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2015-03-24 |
| 8941208 | Reliable surface mount integrated power module | Shakti Singh Chauhan, Arun Virupaksha Gowda | 2015-01-27 |
| 8829690 | System of chip package build-up | Kevin Matthew Durocher, Scott Smith, Laura A. Principe | 2014-09-09 |
| 8742558 | Component protection for advanced packaging applications | Arun Virupaksha Gowda, Elizabeth Ann Burke, Kevin Matthew Durocher | 2014-06-03 |
| 8704211 | High integrity protective coatings | Tae Won Kim, Min Yan, Christian Maria Anton Heller, Marc Schaepkens, Thomas Bert Gorczyca +1 more | 2014-04-22 |
| 8691371 | Barrier coating and method | Tae Won Kim, Min Yan, Ahmet Gun Erlat, Thomas Bert Gorczyca, Christian Maria Anton Heller +1 more | 2014-04-08 |
| 8658473 | Ultrathin buried die module and method of manufacturing thereof | Scott Smith, Elizabeth Ann Burke | 2014-02-25 |
| 8653670 | Electrical interconnect for an integrated circuit package and method of making same | Kevin Matthew Durocher, Scott Smith, Donald Paul Cunningham | 2014-02-18 |
| 8653635 | Power overlay structure with leadframe connections | Arun Virupaksha Gowda | 2014-02-18 |
| 8629003 | Epoxy encapsulating and lamination adhesive and method of making same | Thomas Bert Gorczyca | 2014-01-14 |
| 8623699 | Method of chip package build-up | Kevin Matthew Durocher, Scott Smith, Laura A. Principe | 2014-01-07 |
| 8586421 | Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance | Richard Alfred Beaupre, Arun Virupaksha Gowda, Thomas Bert Gorczyca | 2013-11-19 |
| 8466007 | Power semiconductor module and fabrication method | Eladio Clemente Delgado, Richard Alfred Beaupre, Stephen Daley Arthur, Ernest Wayne Balch, Kevin Matthew Durocher +1 more | 2013-06-18 |
| 8431444 | Epoxy encapsulating and lamination adhesive and method of making same | Thomas Bert Gorczyca | 2013-04-30 |
| 8334593 | Semiconductor device package | Arun Virupaksha Gowda | 2012-12-18 |
| 8310040 | Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof | Richard Alfred Beaupre, Arun Virupaksha Gowda, Thomas Bert Gorczyca | 2012-11-13 |
| 8114712 | Method for fabricating a semiconductor device package | Arun Virupaksha Gowda | 2012-02-14 |
| 8114708 | System and method for pre-patterned embedded chip build-up | Donald Paul Cunningham, Kevin Matthew Durocher | 2012-02-14 |
| 8049338 | Power semiconductor module and fabrication method | Eladio Clemente Delgado, Richard Alfred Beaupre, Stephen Daley Arthur, Ernest Wayne Balch, Kevin Matthew Durocher +1 more | 2011-11-01 |
| 8008125 | System and method for stacked die embedded chip build-up | Kevin Matthew Durocher, Donald Paul Cunningham | 2011-08-30 |