LZ

Liming Zhang

GE: 10 patents #3,350 of 36,430Top 10%
AL Alibaba: 7 patents #108 of 2,313Top 5%
AT AT&T: 6 patents #3,053 of 18,772Top 20%
VT Vlsi Technology: 5 patents #103 of 594Top 20%
Lam Research: 4 patents #662 of 2,128Top 35%
Alcatel Lucent: 4 patents #1,243 of 4,169Top 30%
ZC Zhuhai Juntian Electronic Technology Co.: 3 patents #1 of 15Top 7%
LU Lanzhou Jiaotong University: 3 patents #4 of 30Top 15%
Applied Materials: 2 patents #3,641 of 7,310Top 50%
SC Shanghai Synergy Pharmaceutical Sciences Co.: 2 patents #7 of 30Top 25%
TE Tencent: 1 patents #4,257 of 8,131Top 55%
TH Triquint Technology Holding: 1 patents #47 of 141Top 35%
QT Qingdao University Of Technology: 1 patents #168 of 480Top 35%
ZC Zhejiang Huahai Pharmaceutical Co.: 1 patents #57 of 179Top 35%
ZU Zhejiang University: 1 patents #773 of 2,379Top 35%
CC China University Of Petroleum (East China): 1 patents #254 of 736Top 35%
CO Comcast: 1 patents #2,409 of 4,447Top 55%
Huawei: 1 patents #8,196 of 15,535Top 55%
IN Intel: 1 patents #18,218 of 30,777Top 60%
Xiaomi: 1 patents #677 of 1,395Top 50%
📍 Reston, VA: #9 of 864 inventorsTop 2%
🗺 Virginia: #206 of 34,511 inventorsTop 1%
Overall (All Time): #42,564 of 4,157,543Top 2%
57
Patents All Time

Issued Patents All Time

Showing 51–57 of 57 patents

Patent #TitleCo-InventorsDate
6346032 Fluid dispensing fixed abrasive polishing pad Andrew J. Black, Landon B. Vines 2002-02-12
6341998 Integrated circuit (IC) plating deposition system and method 2002-01-29
6315645 Patterned polishing pad for use in chemical mechanical polishing of semiconductor wafers Milind Weling 2001-11-13
6196900 Ultrasonic transducer slurry dispenser Samuel V. Dunton, Milind Weling 2001-03-06
6165956 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film Yuexing Zhao, Diane Hymes, Wilbur C. Krusell 2000-12-26
6162301 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film Yuexing Zhao, Diane Hymes, Wilbur C. Krusell 2000-12-19
6159075 Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process 2000-12-12