Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7221238 | Superconducting filter device | Akihiko Akasegawa, Manabu Kai, Kazunori Yamanaka | 2007-05-22 |
| 7218184 | Superconducting filter | Kazunori Yamanaka, Manabu Kai, Akihiko Akasegawa | 2007-05-15 |
| 6980841 | Filter device having spiral resonators connected by a linear section | Manabu Kai, Kazunori Yamanaka, Akihiko Akasegawa | 2005-12-27 |
| 6764938 | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof | Toshiya Akamatsu, Kazuaki Karasawa, Kozo Shimizu | 2004-07-20 |
| 6690957 | High temperature superconductor film, method for forming the same and superconductor element | Akihiko Akasegawa, Kazunori Yamanaka | 2004-02-10 |
| 6608381 | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof | Toshiya Akamatsu, Kazuaki Karasawa, Kozo Shimizu | 2003-08-19 |
| 6136047 | Solder bump transfer plate | Kazuaki Karasawa, Toshiya Akamatsu | 2000-10-24 |
| 6121062 | Process of fabricating semiconductor unit employing bumps to bond two components | Kazuaki Karasawa, Kaoru Hashimoto, Toshihiro Sakamura | 2000-09-19 |
| 6008071 | Method of forming solder bumps onto an integrated circuit device | Kazuaki Karasawa, Toshiya Akamatsu | 1999-12-28 |
| 5977637 | Integrated electronic device having flip-chip connection with circuit board | Toshiya Akamatsu, Kazuaki Karasawa, Kozo Shimizu | 1999-11-02 |
| 5611481 | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof | Toshiya Akamatsu, Kazuaki Karasawa, Kozo Shimizu | 1997-03-18 |
| 5284796 | Process for flip chip connecting a semiconductor chip | Kazuaki Karasawa, Masayuki Ochiai, Kaoru Hashimoto | 1994-02-08 |