Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9660065 | Semiconductor device and method for producing same having multilayer wiring structure with contact hole having hydrophobic film formed on side surface of the contact hole | Naoya Okamoto | 2017-05-23 |
| 9647084 | Semiconductor device and method of manufacturing the same | Naoya Okamoto, Kozo Makiyama, Toshihiro Ohki | 2017-05-09 |
| 9608083 | Semiconductor device | Masahito Kanamura, Norikazu Nakamura, Toyoo Miyajima, Masayuki Takeda, Keiji Watanabe +4 more | 2017-03-28 |
| 9553152 | Semiconductor device | Toshihiro Ohki, Lei Zhu, Naoya Okamoto, Yuichi Minoura | 2017-01-24 |
| 9412830 | Semiconductor device and method of manufacturing semiconductor device | Kozo Makiyama | 2016-08-09 |
| 9324808 | Semiconductor device, power-supply unit, amplifier and method of manufacturing semiconductor device | Norikazu Nakamura, Masayuki Takeda, Keiji Watanabe | 2016-04-26 |
| 9306052 | Compound semiconductor device and method of manufacturing the same | Naoya Okamoto | 2016-04-05 |
| 9257514 | Semiconductor device with plural electrodes formed on substrate | Naoya Okamoto, Kozo Makiyama, Toshihiro Ohki | 2016-02-09 |
| 9209042 | Compound semiconductor device and manufacturing method therefor | Naoya Okamoto, Kozo Makiyama, Toshihiro Ohki, Yuichi Minoura, Toyoo Miyajima | 2015-12-08 |
| 9165851 | Semiconductor device, method for manufacturing the same, power supply apparatus and high-frequency amplification unit | Masayuki Takeda | 2015-10-20 |
| 9035357 | Compound semiconductor device and manufacturing method therefor | Kozo Makiyama, Naoya Okamoto, Toshihiro Ohki, Yuichi Minoura, Toyoo Miyajima | 2015-05-19 |
| 9035353 | Compound semiconductor device comprising electrode above compound semiconductor layer and method of manufacturing the same | Toshihiro Ohki, Naoya Okamoto, Yuichi Minoura, Kozo Makiyama | 2015-05-19 |
| 8956967 | Method of forming an interconnection structure | Yoshihiro Nakata | 2015-02-17 |
| 8866157 | Semiconductor device and method of fabricating the semiconductor device | Norikazu Nakamura, Masayuki Takeda, Toyoo Miyajima, Toshihiro Ohki, Masahito Kanamura +3 more | 2014-10-21 |
| 8815017 | Method of manufacturing semiconductor device and method of cleaning semiconductor substrate | Masayuki Takeda, Norikazu Nakamura, Junichi Kon | 2014-08-26 |
| 8791465 | Compound semiconductor device and manufacturing therefor | Naoya Okamoto, Kozo Makiyama, Toshihiro Ohki, Yuichi Minoura, Toyoo Miyajima | 2014-07-29 |
| 8716209 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | Yasushi Kobayashi, Kouta Yoshikawa, Yoshihiro Nakata, Tadahiro Imada | 2014-05-06 |
| 8709886 | Compound semiconductor device and manufacturing method therefor | Kozo Makiyama, Naoya Okamoto, Toshihiro Ohki, Yuichi Minoura, Toyoo Miyajima | 2014-04-29 |
| 8637409 | Etching method, method for manufacturing semiconductor device, and etching device | Masayuki Takeda | 2014-01-28 |
| 8580907 | Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof | Yasushi Kobayashi, Yoshihiro Nakata | 2013-11-12 |
| 8487384 | Semiconductor device, power-supply unit, amplifier and method of manufacturing semiconductor device | Norikazu Nakamura, Masayuki Takeda, Keiji Watanabe | 2013-07-16 |
| 8461041 | Semiconductor device and method of manufacturing semiconductor device | Yoshihiro Nakata, Yasushi Kobayashi, Yuichi Minoura | 2013-06-11 |
| 8431464 | Process for producing silicic coating, silicic coating and semiconductor device | Yasushi Kobayashi, Kouta Yoshikawa, Yoshihiro Nakata, Tadahiro Imada | 2013-04-30 |
| 8390099 | Interconnection substrate having first and second insulating films with an adhesion enhancing layer therebetween | Yoshihiro Nakata, Tadahiro Imada, Yasushi Kobayashi | 2013-03-05 |
| 8207059 | Silicon compound, ultraviolet absorbent, method for manufacturing multilayer wiring device and multilayer wiring device | Yoshihiro Nakata, Ei Yano | 2012-06-26 |