Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664342 | Semiconductor device with a laser-connected terminal | Ryoichi Kato, Yoshinari Ikeda, Yuma MURATA | 2023-05-30 |
| 10446460 | Semiconductor device | Hiromichi Gohara, Kohei Yamauchi, Tatsuo Nishizawa, Yoshitaka Nishimura | 2019-10-15 |
| 10157877 | Semiconductor device and manufacturing method of semiconductor device | Kazumasa Kido, Takashi Saitou, Kyouhei Fukuda, Fumihiko MOMOSE, Yoshitaka Nishimura | 2018-12-18 |
| 9786587 | Semiconductor device and method for manufacturing the semiconductor device | Tatsuo Nishizawa, Yoshito Kinoshita, Yoshinari Ikeda, Eiji Mochizuki | 2017-10-10 |
| 9579746 | Thermocompression bonding structure and thermocompression bonding method | Yoshito Kinoshita, Eiji Mochizuki, Tatsuo Nishizawa | 2017-02-28 |
| 9504154 | Semiconductor device | Eiji Mochizuki, Hideyo Nakamura, Masafumi Horio | 2016-11-22 |
| 9406603 | Semiconductor device and method for manufacturing the semiconductor device | Tatsuo Nishizawa, Yoshito Kinoshita, Yoshinari Ikeda, Eiji Mochizuki | 2016-08-02 |
| 8196300 | Manufacturing method of electric contact and manufacturing equipment of electric contact | Seiji Imamura, Mamoru Akimoto, Yuuichi Yamamoto, Toshiya Shibayanagi | 2012-06-12 |
| 6425173 | Method of handling a forming die between die forming operations | Akio Enomoto, Hiroshi Kashiwagi | 2002-07-30 |
| 6365097 | Solder alloy | Mitsuo Yamashita, Kunio Shiokawa | 2002-04-02 |
| 6179935 | Solder alloys | Mitsuo Yamashita, Kunio Shiokawa | 2001-01-30 |
| 6156132 | Solder alloys | Mitsuo Yamashita, Kunio Shiokawa | 2000-12-05 |
| 6135752 | Forming die and managing method thereof | Akio Enomoto, Hiroshi Kashiwagi | 2000-10-24 |