Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705419 | Packaging structure for bipolar transistor with constricted bumps | Ryoichi Kato, Yoshinari Ikeda, Eiji Mochizuki | 2023-07-18 |
| 11545409 | Semiconductor module having block electrode bonded to collector electrode and manufacturing method thereof | Ryoichi Kato, Yoshinari Ikeda, Motohito HORI, Eiji Mochizuki | 2023-01-03 |
| 11171078 | Semiconductor device and method for manufacturing the same | Yuichiro HINATA | 2021-11-09 |
| 11133609 | Semiconductor device having terminal pin connected by connecting member and method of manufacturing semiconductor device | Yuichiro HINATA | 2021-09-28 |
| 11037848 | Semiconductor module and semiconductor module manufacturing method | Yuhei NISHIDA | 2021-06-15 |
| 10991650 | Semiconductor device and method of manufacturing semiconductor device | — | 2021-04-27 |
| 10923414 | Semiconductor device and method of manufacturing semiconductor device | Hideyo Nakamura | 2021-02-16 |
| 10636316 | Education support system and terminal device | Yusuke TASHIRO | 2020-04-28 |
| 10446460 | Semiconductor device | Hiromichi Gohara, Kohei Yamauchi, Shinji Tada, Yoshitaka Nishimura | 2019-10-15 |
| 10297165 | Education support system and terminal device | Yusuke TASHIRO | 2019-05-21 |
| 10109603 | Semiconductor device | Kyohei Fukuda | 2018-10-23 |
| 9999146 | Semiconductor module | Motohito HORI, Yoshinari Ikeda, Hideyo Nakamura, Eiji Mochizuki | 2018-06-12 |
| 9824950 | Semiconductor device | Kyohei Fukuda, Yuhei NISHIDA, Eiji Mochizuki | 2017-11-21 |
| 9786587 | Semiconductor device and method for manufacturing the semiconductor device | Shinji Tada, Yoshito Kinoshita, Yoshinari Ikeda, Eiji Mochizuki | 2017-10-10 |
| 9711430 | Semiconductor device, method for installing heat dissipation member to semiconductor device, and a method for producing semiconductor device | Yuhei NISHIDA | 2017-07-18 |
| 9679566 | Apparatus for synchronously processing text data and voice data | Tomoki Kodaira | 2017-06-13 |
| 9627342 | Electronic component and method of manufacturing electronic component | Takashi Saito, Yoshito Kinoshita, Norihiro Nashida | 2017-04-18 |
| 9579746 | Thermocompression bonding structure and thermocompression bonding method | Yoshito Kinoshita, Eiji Mochizuki, Shinji Tada | 2017-02-28 |
| 9406603 | Semiconductor device and method for manufacturing the semiconductor device | Shinji Tada, Yoshito Kinoshita, Yoshinari Ikeda, Eiji Mochizuki | 2016-08-02 |
| 9385103 | Semiconductor device manufacturing method | Shinji Sano | 2016-07-05 |
| 9361905 | Voice data playback speed conversion method and voice data playback speed conversion device | Shoji Tsunoda | 2016-06-07 |
| 9355987 | Electronic component and manufacturing method for electronic component | Takashi Saito, Yoshito Kinoshita, Norihiro Nashida | 2016-05-31 |
| 9299642 | Semiconductor device and method for producing same | Yuhei NISHIDA, Masanori Tanaka | 2016-03-29 |
| 8944310 | Method of manufacturing a semiconductor device | Takeshi Matsushita, Eiji Mochizuki, Shunsuke Saito | 2015-02-03 |
| D689833 | Semiconductor device | Motohito HORI, Yoshinari Ikeda, Eiji Mochizuki | 2013-09-17 |