Issued Patents All Time
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249556 | Cooler and semiconductor apparatus | Kensuke Matsuzawa, Takahiro Koyama | 2025-03-11 |
| 12148631 | Semiconductor module, method for manufacturing semiconductor module, and level different jig | Kazunaga Onishi, Takashi Masuzawa | 2024-11-19 |
| 12127382 | Semiconductor module with cooling fins in a matrix form | Yoshihiro TATEISHI, Tatsuhiko Asai, Takahiro Koyama | 2024-10-22 |
| 12087655 | Semiconductor apparatus and vehicle | Yuta Tamai, Takafumi Yamada | 2024-09-10 |
| 12074091 | Semiconductor device with cooler including heat dissipating substrate having a plurality of fins bonded to reinforcing plate | Takahiro Koyama | 2024-08-27 |
| 12072155 | Heat exchanger having cured edge | Akihito Aoki, Eiji Anzai, Yoshinari Ikeda, Ryoichi Kato, Michihiro Inaba +1 more | 2024-08-27 |
| 11996350 | Cooler and semiconductor apparatus | Yoshihiro TATEISHI, Takahiro Koyama | 2024-05-28 |
| 11908772 | Semiconductor module and vehicle | Takafumi Yamada | 2024-02-20 |
| 11664296 | Semiconductor module and vehicle | Kensuke Matsuzawa, Takahiro Koyama | 2023-05-30 |
| D983759 | Semiconductor module | Daiki YOSHIDA, Shin Soyano | 2023-04-18 |
| 11624562 | Heat sink | Takumi Nakamura, Eiji Anzai, Tomoyuki Hirayama, Yutaka Hirano, Ryoichi Kato +1 more | 2023-04-11 |
| 11582889 | Semiconductor module and vehicle | Takafumi Yamada, Daiki YOSHIDA | 2023-02-14 |
| 11581252 | Semiconductor module and wire bonding method | Takafumi Yamada, Kohei Yamauchi, Tatsuhiko Asai | 2023-02-14 |
| 11501980 | Semiconductor module, method for manufacturing semiconductor module, and level different jig | Kazunaga Onishi, Takashi Masuzawa | 2022-11-15 |
| 11444004 | Cooler | Ryoichi Kato, Yoshinari Ikeda, Tomoyuki Miyashita, Shingo Otake | 2022-09-13 |
| 11387210 | Semiconductor module and manufacturing method therefor | Takafumi Yamada | 2022-07-12 |
| 11315854 | Semiconductor device and method of manufacturing semiconductor device | Ryoichi Kato, Yoshinari Ikeda, Yoshikazu Takahashi, Kuniteru Mihara, Isao Takahashi | 2022-04-26 |
| 11201121 | Semiconductor device | Kohei Yamauchi, Ryoichi Kato, Yoshinari Ikeda, Katsumi Taniguchi | 2021-12-14 |
| 11158563 | Power semiconductor module and vehicle | Takafumi Yamada, Yuta Tamai | 2021-10-26 |
| 11075144 | Cooler and semiconductor module | Ryoichi Kato, Yoshinari Ikeda, Tomoyuki Miyashita, Yoshihiro TATEISHI, Shunsuke Numata | 2021-07-27 |
| 10971431 | Semiconductor device, cooling module, power converting device, and electric vehicle | Kohei Yamauchi, Katsumi Taniguchi | 2021-04-06 |
| 10916491 | Semiconductor module | Ryoichi Kato, Kohei Yamauchi, Tatsuhiko Asai | 2021-02-09 |
| D903612 | Semiconductor module | Shin Soyano | 2020-12-01 |
| 10468333 | Cooling apparatus, semiconductor module, and vehicle | Takafumi Yamada, Yuta Tamai | 2019-11-05 |
| 10461012 | Semiconductor module with reinforcing board | Akira Morozumi, Takafumi Yamada | 2019-10-29 |