Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461012 | Semiconductor module with reinforcing board | Hiromichi Gohara, Takafumi Yamada | 2019-10-29 |
| 10128167 | Semiconductor module and manufacturing method of semiconductor module | Hiromichi Gohara, Yoshitaka Nishimura | 2018-11-13 |
| 9673130 | Semiconductor device having a cooler | Hiromichi Gohara, Takeshi Ichimura | 2017-06-06 |
| 9293391 | Semiconductor module cooler and semiconductor module | Hiromichi Gohara, Takeshi Ichimura | 2016-03-22 |
| 9269644 | Method for producing semiconductor device | Yoshitaka Nishimura, Kazunaga Ohnishi, Eiji Mochizuki, Yoshikazu Takahashi | 2016-02-23 |
| 9263367 | Semiconductor device | Takaki Nakagawa, Daisuke Takeuchi, Yasuhiro Maeda, Hiromichi Gohara, Takeshi Ichimura | 2016-02-16 |
| 9245821 | Cooling device for semiconductor module, and semiconductor module | Hiromichi Gohara, Takeshi Ichimura | 2016-01-26 |
| 9237676 | Semiconductor module cooler and semiconductor module | Hiromichi Gohara, Takeshi Ichimura | 2016-01-12 |
| 9179578 | Semiconductor module and heat radiation member | Shin Soyano, Masaki Ono, Kenji Suzuki | 2015-11-03 |
| 8933557 | Semiconductor module and cooling unit | Hiromichi Gohara, Keiichi Higuchi | 2015-01-13 |
| 8902589 | Semiconductor module and cooler | Hiromichi Gohara, Takeshi Ichimura | 2014-12-02 |
| 8673691 | Method for manufacturing a semiconductor device | Yoshinari Ikeda, Shin Soyano, Kenji Suzuki, Yoshikazu Takahashi | 2014-03-18 |
| 8450845 | Semiconductor device | Yoshinari Ikeda, Shin Soyano, Kenji Suzuki, Yoshikazu Takahashi | 2013-05-28 |
| 7816249 | Method for producing a semiconductor device using a solder alloy | Shin Soyano, Yoshikazu Takahashi | 2010-10-19 |
| 7781258 | Manufacturing method of semiconductor device | Susumu Toba, Kazuo Furihata | 2010-08-24 |
| 7514785 | Semiconductor device and manufacturing method thereof | Susumu Toba, Kazuo Furihata | 2009-04-07 |
| 6914325 | Power semiconductor module | Takatoshi Kobayashi, Tadashi Miyasaka, Katsumi Yamada | 2005-07-05 |
| 6905063 | Method of manufacturing semiconductor device | Tadashi Miyasaka, Katsumi Yamada, Eiji Mochizuki | 2005-06-14 |
| 6844621 | Semiconductor device and method of relaxing thermal stress | Yoshitaka Nishimura, Souichi Okita | 2005-01-18 |
| 6690087 | Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base | Takatoshi Kobayashi, Tadashi Miyasaka, Katsumi Yamada | 2004-02-10 |
| 5869890 | Insulation substrate for a semiconductor device | Masaharu Nishiura, Tomio Shimizu, Katsumi Yamada, Shigemasa Saito | 1999-02-09 |
| 5675181 | Zirconia-added alumina substrate with direct bonding of copper | Masaharu Nishiura, Shigemasa Saito, Shizuyasu Yosida, Katumi Yamada, Toshio Nozaki +4 more | 1997-10-07 |