Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10896892 | Wire bonding apparatus | Fumihiko MOMOSE, Takashi Saito, Yoshitaka Nishimura | 2021-01-19 |
| 10157877 | Semiconductor device and manufacturing method of semiconductor device | Takashi Saitou, Kyouhei Fukuda, Shinji Tada, Fumihiko MOMOSE, Yoshitaka Nishimura | 2018-12-18 |
| 9978701 | Semiconductor device | Takashi Saito, Fumihiko MOMOSE, Yoshitaka Nishimura | 2018-05-22 |
| 9748186 | Semiconductor device and method for manufacturing the semiconductor device | Fumihiko MOMOSE, Takashi Saito, Yoshitaka Nishimura | 2017-08-29 |
| 8860220 | Semiconductor device and method for manufacturing the same | Fumihiko MOMOSE, Yoshitaka Nishimura, Fumio Shigeta | 2014-10-14 |
| 8395262 | Semiconductor device and method for manufacturing the same | Fumihiko MOMOSE, Yoshitaka Nishimura, Fumio Shigeta | 2013-03-12 |