CP

Cuong Pham

Ford: 12 patents #1,486 of 17,473Top 9%
TI Teledyne Industries: 8 patents #3 of 87Top 4%
NW Novatel Wireless: 6 patents #6 of 51Top 15%
VT Visteon Global Technologies: 5 patents #229 of 1,929Top 15%
IN Intermedics: 2 patents #49 of 121Top 45%
AC Active-Semi: 1 patents #29 of 45Top 65%
📍 Hanoi, MI: #1 of 1 inventorsTop 100%
Overall (All Time): #103,546 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 26–34 of 34 patents

Patent #TitleCo-InventorsDate
5899759 Electrical connector for rigid circuit boards Yew Thye Yeow 1999-05-04
5732873 Magnetic energy monitor for an ultrasonic wirebonder Mark Stephen Topping, Brian John Hayden 1998-03-31
5681663 Heatspreader carrier strip Alfred Schaller 1997-10-28
5655700 Ultrasonic flip chip bonding process and apparatus Brian John Hayden, Bethany J. Walles 1997-08-12
5598096 Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal Brian John Hayden, Bethany J. Walles, Peter R. Cibirka 1997-01-28
5579573 Method for fabricating an undercoated chip electrically interconnected to a substrate Jay DeAvis Baker, Robert Edward Belke 1996-12-03
5510721 Method and adjustment for known good die testing using resilient conductive straps Bethany J. Walles, Lawrence Kneisel, Brian John Hayden 1996-04-23
5427301 Ultrasonic flip chip process and apparatus Brian John Hayden, Bethany J. Walles 1995-06-27
5275058 Method and apparatus for detecting wire bond pull test failure modes Brian John Hayden 1994-01-04