Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949410 | Flip chip in leaded molded package and method of manufacture thereof | Rajeev Joshi, Consuelo Tangpuz | 2005-09-27 |
| 6943434 | Method for maintaining solder thickness in flipchip attach packaging processes | Consuelo Tangpuz, Margie T. Rios, Erwin Victor Cruz | 2005-09-13 |
| 6720642 | Flip chip in leaded molded package and method of manufacture thereof | Rajeev Joshi, Consuelo Tangpuz | 2004-04-13 |